Molex Micro-Fit 3.0 Interconnect System
The Micro-Fit 3.0 is a unique interconnect system designed to meet the need for a high contact density signal or power connector and incorporates many of the features previously found on larger power connectors. These 3.00mm (.118") pitch connectors are the perfect choice when you need compact connectors that carry up to 5 amperes of current. Micro-Fit products are available in circuit sizes 2 to 24 for single and dual row, wire-to-board and wire-to-wire applications. The product family has over 500 part numbers, with many retention choices including fitting nails, solderable clips, and offset terminal retention.
The Micro-Fit 3.0 CPI™ and Micro-Fit 3.0 BMI™ CPI are compliant pin interface vertical header product extensions to this well known Micro-Fit family. These products are designed for high-density applications which require press-fit headers. The CPI products are appropriate for both power and signal uses as they can carry up to 5 amperes per circuit.
Micro-Fit 3.0 Overmolded Cable Assemblies are available in multiple circuit sizes and cable lengths, featuring a rugged strain relief for signal and power applications.
Features and Benefits
|SMT, Press-Fit or Surface Mount Compatible versions available||Versatile product line meets many application needs|
|Fully polarized housings||Prevents accidental mismating|
|Positive latching||Prevents accidental disconnects|
|Locking tang on terminal||Secures terminals in housings|
|Headers made of high-temperature LCP material||Able to withstand high-temperature processes|
|Many retention options such as nails and clips||Design flexibility|
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